شبیه سازی و مطالعه ی اثر دمای چشمه در لایه نشانی نانو فیلم های طلا به روش تبخیر حرارتی با استفاده از نرم افزار COMSOL Multiphysics

نوع مقاله: مقاله پژوهشی

نویسندگان

1 هیات علمی

2 کارشناس

3 هیات علمی دانشگاه سمنان

چکیده

در این مقاله، فرآیند لایه نشانی فیلم های نازک طلا، به کمک روش تبخیر حرارتی شبیه سازی شد. برای این منظور از نرم افزار COMSOL Multiphysics استفاده گردید. مدل سه بعدی در محیط نرم افزار ایجاد شده و هندسه، تحلیل مش ها، شرایط مرزی و روابط مورد نیاز معرفی و مورد مطالعه قرار گرفتند. ضخامت، چگالی، شار گرما، فشار و سایر پارامتر های مرتبط با لایه نشانی مورد بررسی قرار گرفتند. با استفاده از رگرسیون صفحه ای، معادله ی سطوح نانو فیلم های طلا محاسبه و اثر دمای چشمه بر رشد فیلم های نازک طلا بررسی گردید. نتایج نشان داد که بین ضخامت فیلم نازک و دمای چشمه رابطه ی مستقیم وجود دارد. با استفاده از برازش غیر خطی مدلی برای وابستگی ضخامت فیلم نازک به دمای چشمه ارائه گردید. با مقایسه نتایج بدست آمده از شبیه سازی ها در این کار برای ضخامت و انحنای سطح فیلم های نازک طلا با رفتار مورد انتظار از توزیع جرم روی زیرلایه، تطابق بین مقادیر شبیه سازی شده و این رفتار مشاهده گردید.

کلیدواژه‌ها


عنوان مقاله [English]

Simulation and Study of Source temperature effect in gold thin films growth prepared via evaporation method using COMSOL Multiphysics

نویسندگان [English]

  • Mohammadhossein Ehsani 1
  • Mahmod Jalali Mehrabad 2
  • Abbas Javadian 3
1 semnan
3 Semnan
چکیده [English]

In the present work, gold thin films growth process using the evaporation method has been simulated. For this purpose, the COMSOL Multiphysics 5.0 simulator software was used. Three-dimensional models were constructed and geometry, mesh analysis, boundary conditions and related relations were defined and studied. Film thickness, density, heat flux and other related parameter to deposition were investigated. Using planar regression, surface equation of the gold thin films was calculated and the effect of the temperature of gold source on thickness of films was investigated. Results showed that there is a correlation between the temperature of source and the thickness of gold films. Using non-linear regression, a model was represented in order to describe the dependency of film thickness on source temperature. Comparing the simulation results in this paper for thickness and curvature of gold thin films with expected behavior distribution on substrate, a promising accommodation between the simulated data and this trend was observed.

کلیدواژه‌ها [English]

  • Evaporation
  • Thin film
  • Simulation
[1] M. Ohering, Materials Science of Thin Films, Deposition and Structure”,
(2002), 2nd Edition, New York, Academic Press.

[2] K.E. Harris, V.V. Singh, A.H, King, “Grain rotation in thin films of gold”. Acta Mater, 46
(1998) 2623-2633.

[3] H.D. Espinosa, B.C. Prorok, “Size effects on the mechanical behavior of
gold thin films”. Journal of Materials Science, 38. (2003) 4125 – 4128.

[4] L. Hultman, A. Robertsson, H. T. G. Hentzell, I. Engström and P. A. Psaras. “Crystallization of
amorphous silicon during thin-film gold reaction”. Journal of Applied Physics,62 (1987) 3647.

[5] L. John “Janning Thin film surface orientation for liquid crystals”.
Applied Physics Letters, 21(1972) 173.

[6] D. Krause, C.W. Teplin, C.T. Rogers, “Optical surface second harmonic measurements of isotropic
thin-film metals: Gold, silver, copper, aluminum, and tantalum”. Journal of Applied Physics, 96
(2004) 3626.

[7] C.H. Claassens, J.J. Terblans, M.J.H. Hoffman, H.C. Swart, “Kinetic Monte Carlo simulation of
monolayer gold film growth on a graphite substrate” Surf. Interface Anal, 37(2005) 1021–1026.

 

 

 

 


[8] C.L. Kuo, P. Clancy, “MEAM molecular dynamics study of a gold thin film on a silicon
substrate”. Surface Science, 551(2004) 39–58.

[9] W.D. Luedtke, U. Landman,. “Metal-on-metal thin-film growth:
Au/Ni(001) and Ni/Au(001)” Physical Review B, 44.(1991) 5970.

[10] H. Zheng. "Molecular Dynamic Simulation of Thin Film Growth Stress
Evolution”. Theses and Dissertations, (2011) Paper 1256.

[11] A. Axelevitch, B. Apter, G. Golan, “Simulation and experimental investigation of optical
transparency in gold island films”. Optics Express 21 (2013)4126.
[12] A. Musset, S. Dvorak, “Basic in Action” (1984). Chap 12, Butterworth. [13] S. Bosch,.
“Computer-aided procedure for optimization of layer thickn-
ess uniformity in thermal evaporation physical vapor deposition chambers
for lens coating”. J. Vac. Sci. Technol. A,10 (1992) 98.

[14] H.A. Macleod, “Thin-Film Optical Filters”. (1986), Macmillan Publish- ing Company, New York.

[15] I. Fuke, V. Prabhu, S. Baek, “Computational Model for Predicting Coating Thickness in Electron
Beam Physical Vapor Deposition”. J. Manufacturing Processes, 7 (2005) 140.

[16] J.B. Oliver, D. Talbot, “Optimization of Deposition Uniformity for Large-aperture National
Ignition Facility Substrates in a Planetary Rotation System”. Appl. Opt. 45, (2006) 3097.

[17] E. N. Kotlikov, V.N. Prokashev, V.A. Ivanov, A.N. Tropin, “Thickness Uniformity of Films
Deposited on Rotating Substrates”. J. Opt. Technol. 76 (2009) 100.

[18] F. Wang, R. Crocker, R. Faber, “Large-area Uniformity in Evaporation Coating through a New
Form of Substrate Motion”. Optical Interference Coatings (2010).

[19] D.J. Woodland, E. Mack Jr. “The Effect of Curvature of Surface on Surface Energy. Rate of
Evaporation of Liquid Droplets. Thickness of Saturated Vapor Films”. J. Am. Chem. Soc., 55 (8),
(1993)3149.

[20] R. Schmidt, M. Parlak, A.W. Brinkman, “Control of the thickness distr- ibution of evaporated
functional electroceramic NTC thermistor thin films”. Journal of Materials Processing Technology,
199, (2008)412.

 

 

 

 


[21] O. Piot, A. Malaurie, J. Machet, “Experimental and theoretical studies of coating thickness
distributions obtained from high rate electron beam evaporation sources”. Thin Solid Films,
293(1997) 124.

[22] L.D. Hall “The Vapor Pressure of Gold and the Activities of Gold in Gold-Copper Solid
Solutions”. J .Am. Chem .Soc, 73, (2)(1951) 757.

[23] F.H. Siyanaki, H.R. Dizaji, M.H. Ehsani, S. Khorramabadi, “The effect of substrate rotation
rate on physical properties of cadmium telluride films prepared by a glancing angle deposition
method" Thin Solid Films 577(2015) 128–133.

 

 

 

 

 

 

 

 

 

 

 

[24]M. Panjan, “Influence of substrate rotation and target arrangement on the periodicity and
uniformity of layered coatings”, Surface & Coatings Technology 235 (2013) 32–44.

 

 

 

 

 

 

 

 

 

 

 

 

 


[25] A. Rauch, R.J. Mendelsberg, J.M. Sanders, A. Anders, J. Appl. Phys.
111 (2012) 083302.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 


[26] A. Anders, Handbook of Plasma Immersion Ion Implantation and Deposition, Wiley, 2000

[27] L. Holland; W. Steckelmacher; “the distribution of thin films condensed
on surfaces by the vacuum evaporation method”; Vacuum 2, (4) (1952) 346.

[28] C. C. Jaing; M. H. Cheng; J. S. Chen; C. H. Tsai; P. S. Yeh; J. S. Kao;
H. Y. Hsiao; “Studying layer uniformity of sputter coatings by intensity distribution of plasma
spectrum”; Applied Surface Science 169-170, (2001)
649-653.

[29] J. Wang; J. Shao; K. Yi; Z. Fan; “Layer uniformity of glancing angle
deposition”; Vacuum 78, (2005) 107–111.

[30] M. Panjan; “Influence of substrate rotation and target arrangement on the periodicity and
uniformity of layered coatings”; Surface & Coatings Technology 235, (2013) 32–44.

[31] S. Todorova; D. Popov; E. Dimitrov; D. Dochev; M. Kanev; “Thickness
uniformity of vacuum deposited layers”; Vacuum 38, (1988) 869-872.

[32] Hagen N. Dereniak E.L. "Gaussian profile estimation in two dimensions,"
Appl. Opt. 47 (2008) 6842-6851.

[33] G.M. Sant'Anna, D.S. Roveri, H.H. Bertan, J.F. Mologni, E.S Braga,
M.A.R Alves, J. of. Electrostatic. 74 (2015) 96-101.