[1] Constable C. P., Yarwood J., Munz W.D. “Raman Microscopic Studies of PVD
Hard Coatings”. Surf. Coat. Technol., 1999; 116-119(2-3): 155.
[2] Becker S.J., Suh S., Wang Sh., Gordon R.G. “Highly Conformal Thin Films of
Tungsten Nitride Prepared by Atomic Layer Deposition from a Novel Precursor”.
Chem. Mater., 2003; 15(15):2969.
[3] Marco J.F., Gancedo J.R., Auger M.A., Sanchez O., Albella J.M. “Chemical
stability of TiN, TiAlN and AlN layers in aggressive SO2 environments”. Surf
Interface Anal., 2005; 37(12): 1082.
[4] Glaser A., Surnev S., Netzer F.P., Fateh N., Fontalvo G.A., Mitterer C.
“Oxidation
of vanadium nitride and titanium nitride coatings”. Surf. Sci., 2007;
601(4): 1153.
[5] Huang C.F., Tsui B.Y., Lu C.H. “Thermal Stability and Electrical Characteristics
of Tungsten Nitride Gates in Metal–Oxide–Semiconductor Devices”. Jpn. J. Appl.
Phys., 2008; 47(2):872.
[6] Chakrapani V., Thangala J., Sunkara M.K. “WO3 and W2N nanowire arrays for
photoelectrochemical hydrogen production”. Hydrogen energy, 2009; 34(22): 9050.
[7] Wang Z., Liu Z., Yang Z., Shingubara S. “Characterization of sputtered tungsten
nitride film and its application to Cu electroless plating”. Microelectronic
Engineering. 2008; 85:395.
[8] Lee C.W., Kim Y.T. “High temperature thermal stability of plasma-deposited
tungsten nitride Schottky contacts to GaAs”. Solid State Electronics, 1995; 38(3):
679.
[9] Lee C.W., Kim Y.T., Min S.K. “Characteristics of plasma enhanced chemical
vapor deposited tungsten nitride thin films”. Appl. Phys Lett., 1993; 62(25): 3312.
[10] Shen Y.G., Mai Y.W., McBride W.E., Zhang Q.C., McKenzie D.R.
“Characteristics in sputtered tungsten nitride films”. Thin Solid Films. 2000; 37(12):
257.
[11] Moriwaki M., Yamada T., Harada Y., Fujii S., Fujii S., Yamanaka M., Shibata
J., Mori Y. “Improved metal gate Process by Simultaneous Gate-Oxide Nitridation
during W/WNx Gate Formation”. Jpn. J. Appl. Phys., 2000; 39 (4): 2177.
[12] Ko A., Han S.B., Lee Y.W., Park K.W. “Template-free synthesis and
characterization of mesoporous tungsten nitride nanoplates. Phys”. Chem. Chem.
Phys., 2011;13(28): 12705.
[13] Levy F., Hones P., Schmid P.E., Sanjines R., Diserns M., Wiemer C.
“Electronic states and mechanical properties in transition metal nitrides”. Surf. Coat.
Technol., 1999; 120/121; 284.
[14] Chang K.M., Yeh T.H., Deng I.C., Shih C.W. “Amorphouslike chemical vapor
deposited tungsten diffusion barrier for copper metallization and effects of nitrogen
addition”. J. Appl. Phys., 1997; 82(3): 1469.
[15] Jiang P.C., Lai Y.S., Chen J.S. “Dependence of crystal structure and work
function of WNx films on the nitrogen content”. Appl. Phys. Lett., 2006; 89(12):
122107.
[16] Bereznai M., Toth Z., Caricato A.P., Fernández M., Luches A., Majni G.,
Mengucci P., Nagy P.M. “Reactive pulsed laser deposition of thin molybdenum- and
tungsten-nitride films”. Thin Solid Films. 2005; 473(1): 16.
[17] Chang K.M., Yeh T.H., Deng I.C.
“Nitridation of fine grain chemical vapor
deposited tungsten film as diffusion barrier for aluminum metallization”. Appl.
Phys., 1997; 81(8): 3670.
[18] Eizenberg M., Meyer F., Benhocine A., Bouchier D. “Reactive-ion-beamsputtered
WNx films on silicon: Growth mode and electrical properties”. J. Appl.
Phys., 1994; 75(8): 3900.
[19] Yamamoto T., Kawate M., Hasegawa H., Suzuki T. “Effects of Nitrogen
Concentration on Microstructures of WNX Films Synthesized by Cathodic Arc
Method”. Surf. Coat. Technol., 2005; 193(1-3): 372.
[20] Etaii G.R., Hosseinnejad M.T., Ghoranneviss M., Habibi M., Shirazi M.
“Deposition of tungsten nitride on stainless steel substrates using plasma focus
device”. Nuclear Instruments and Methods in Physics Research B. 2011; 269(10):
1058.
[21] Bystrova S., Aarnink A.A.I., Holleman J., Wolters R. “Atomic Layer
Deposition of W1.5N Barrier Films for Cu Metallization”. J. Electrochem. Soc.,
2005; 152(7): 522.
[22] Lu J.P., Hsu Y., Luttmer J.D., Magel L., Tsai H.L. “A New Process for
Depositing Tungsten Nitride Thin Films”. J. Electrochem. Soc., 1998; 145(2): 21.
[23] Tsai M.H., Chiu H.T., Chuang S.H. “Metalorganic chemical vapor deposition
of tungsten nitride for advanced metallization”. Appl. Phys. Lett., 1996;